{
  "$schema": "https://foodadditiveindex.com/api/v1/schema.json",
  "id": "https://foodadditiveindex.com/additives/lead-solders",
  "slug": "lead-solders",
  "name": "Lead solders",
  "identifiers": {
    "e_number": null,
    "ins_number": null,
    "cas_number": null,
    "inchikey": null,
    "pubchem_cid": null
  },
  "functional_class": null,
  "summary": "Lead solder was once used to seal the side seams of food cans, and lead migrated from the seam into the contents. The FDA prohibited it, and US canners moved to welded seams; this is a prohibition on a material used to make food packaging rather than on anything added to food.",
  "derivation_summary": "An alloy of lead and tin used to join metal. It is not an ingredient and never was: it is listed here because 21 CFR 189 Subpart D prohibits substances from reaching food indirectly, through the surfaces food touches.",
  "regulatory_status": [
    {
      "jurisdiction": "US",
      "jurisdiction_name": "United States",
      "authority": "Food and Drug Administration",
      "status": "prohibited",
      "status_label": "Prohibited",
      "provision_count": 1,
      "provisions": [
        {
          "status": "prohibited",
          "food_category": null,
          "max_level": null,
          "max_level_unit": null,
          "conditions": "Prohibited from indirect addition to human food through food-contact surfaces.",
          "effective_from": null,
          "citation": {
            "ref": "21 CFR 189.240",
            "url": "https://www.ecfr.gov/current/title-21/section-189.240"
          },
          "source": "ecfr",
          "retrieved_at": "2026-09-07T18:25:51.549Z"
        }
      ]
    },
    {
      "jurisdiction": "CODEX",
      "jurisdiction_name": "Codex Alimentarius",
      "authority": "Codex Alimentarius Commission / JECFA",
      "status": "not_listed",
      "status_label": "Not listed",
      "note": "Does not appear on this jurisdiction’s permitted list. That is not the same as being prohibited.",
      "provision_count": 0,
      "provisions": []
    }
  ],
  "names": [
    {
      "name": "Lead solders",
      "type": "label",
      "source": "ecfr"
    }
  ],
  "hazard_reference_values": [],
  "sources": [
    {
      "key": "ecfr",
      "name": "Electronic Code of Federal Regulations, Title 21",
      "publisher": "U.S. Government Publishing Office / National Archives",
      "licence": "Public domain",
      "url": "https://www.ecfr.gov/api/versioner/v1/full/2026-08-31/title-21.xml",
      "retrieved_at": "2026-09-07T18:25:51.549Z"
    }
  ],
  "citation_policy": "Cite as: Food Additive Index, \"Lead solders\", https://foodadditiveindex.com/additives/lead-solders. This site reports regulatory status and does not rate additives.",
  "generated_at": "2026-09-08T00:09:38.575Z"
}